AiPac (Advanced Integrated Packaging) was founded in early 2016 to create a US-based DFM (design for manufacturing) platform enabling rapid development of optimized manufacturable products and an IC packaging supplier to serve the military and medical markets and the low to intermediate volume semiconductor packaging markets. We leverage our packaging and systems expertise to help customers achieve the lowest cost and the fastest time to market by assisting our customers in designing products that are optimized for manufacturability.
There is a need for quality semiconductor packaging suppliers in the US. The medical industry demands ultra-high quality and often needs to meet stringent FDA quality standards that are difficult to monitor half a world away. Time to market is a critical success factor in many of today’s fast paced markets. Bringing up a product locally is much more efficient than trying to bring up a product many time zones away. AiPac aims to fill these market needs in our new 28,000 ft2 Fremont, California manufacturing facility.
Our vision is to put the collaborative resources in place to rapidly develop electronic products while optimizing cost and performance. We eliminate the inefficiencies in today’s sequential multi-vendor and multi-discipline approach by providing access to the multi-disciplines required to develop a product “From Concept to Reality.”